Invention Grant
- Patent Title: Semiconductor substrate with a single protruding portion with multiple different widths and insulation thickness
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Application No.: US15213369Application Date: 2016-07-18
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Publication No.: US10043814B2Publication Date: 2018-08-07
- Inventor: Tomohiro Yamashita
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2015-167218 20150826
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/66 ; H01L29/78 ; H01L21/8234 ; H01L29/792 ; H01L21/28 ; H01L29/423 ; H01L27/12 ; H01L29/417 ; H01L27/11521 ; H01L27/11568 ; H01L27/1157 ; H01L27/11573

Abstract:
A semiconductor device includes: a fin that is a portion of a semiconductor substrate, protrudes from a main surface of the semiconductor substrate, has a width in a first direction, and extends in a second direction; a control gate electrode that is arranged on the fin via a first gate insulating film and extends in the first direction; and a memory gate electrode that is arranged on the fin via a second gate insulating film and extends in the first direction. Further, a width of the fin in a region in which the memory gate electrode is arranged via the second gate insulating film having a film thickness larger than the first gate insulating film is smaller than a width of the fin in a region in which the control gate electrode is arranged via the first gate insulating film.
Public/Granted literature
- US20170062445A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-03-02
Information query
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