Invention Grant
- Patent Title: Semiconductor device and a method for forming a semiconductor device
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Application No.: US15414872Application Date: 2017-01-25
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Publication No.: US10043866B2Publication Date: 2018-08-07
- Inventor: Jens Peter Konrath , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102016101670 20160129
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/06 ; H01L29/78 ; H01L21/265 ; H01L29/66

Abstract:
A method for forming a semiconductor device includes forming an oxide layer on a semiconductor substrate. A first portion of the oxide layer forms a gate oxide of a transistor structure. The method further includes replacing or modifying a second portion of the oxide layer to obtain a contamination barrier layer structure comprising phosphorus. The contamination barrier layer structure is located at a distance of less than 10 μm from the first portion of the oxide layer.
Public/Granted literature
- US20170221987A1 Semiconductor Device and a Method for Forming a Semiconductor Device Public/Granted day:2017-08-03
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