Invention Grant
- Patent Title: Methods for forming a semiconductor device with a gate stack having angled sidewalls
-
Application No.: US15376610Application Date: 2016-12-12
-
Publication No.: US10043887B2Publication Date: 2018-08-07
- Inventor: Che-Cheng Chang , Yi-Jen Chen , Chang-Yin Chen , Yung Jung Chang
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/423 ; H01L21/3213 ; H01L29/51 ; H01L21/3205

Abstract:
A semiconductor device includes a metal gate stack. The metal gate stack includes a high-k gate dielectric and a metal gate electrode over the high-k gate dielectric. The metal gate electrode includes a first top surface and a second bottom surface substantially diametrically opposite the first top surface. The first top surface includes a first surface length and the second bottom surface includes a second surface length. The first surface length is larger than the second surface length. A method of forming a semiconductor device is provided.
Public/Granted literature
- US20170092741A1 SEMICONDUCTOR DEVICE WITH AN ANGLED SIDEWALL GATE STACK Public/Granted day:2017-03-30
Information query
IPC分类: