Invention Grant
- Patent Title: Optoelectronic semiconductor chip
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Application No.: US15522783Application Date: 2015-10-20
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Publication No.: US10043949B2Publication Date: 2018-08-07
- Inventor: Fabian Kopp , Christian Eichinger , Korbinian Perzlmaier
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO Semiconductors GmbH
- Current Assignee: OSRAM OPTO Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Viering, Jentschura & Partner MBB
- Priority: DE102014115740 20141029
- International Application: PCT/EP2015/074258 WO 20151020
- International Announcement: WO2016/066477 WO 20160506
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/42 ; H01L33/10 ; H01L33/38 ; H01L33/24 ; H01L33/32

Abstract:
According to the present disclosure, optoelectronic semiconductor chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and one active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer. The p-doped semiconductor layer is electrically contacted by means of a first metallic connection layer, and a reflection-enhancing dielectric layer sequence is arranged between the p-doped semiconductor layer and the first connection layer, which dielectric layer sequence includes a plurality of dielectric layers with different refractive indices.
Public/Granted literature
- US10079329B2 Optoelectronic semiconductor chip Public/Granted day:2018-09-18
Information query
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