A light emitting diode (LED) package includes a package body; an LED chip above the package body; a first wavelength conversion layer containing a first wavelength conversion material, and an upper surface portion covering a part of an upper surface of the LED chip and a lateral portion covering side surfaces of the LED chip; and a second wavelength conversion layer containing a second wavelength conversion material different from the first wavelength conversion material, and covering the first wavelength conversion layer and a remaining part of the upper surface of the LED chip.