- Patent Title: Light emitting diode chip having wavelength converting layer and method of fabricating the same, and package having the light emitting diode chip and method of fabricating the same
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Application No.: US15703725Application Date: 2017-09-13
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Publication No.: US10043955B2Publication Date: 2018-08-07
- Inventor: Jung Hwa Jung , Bang Hyun Kim
- Applicant: Seoul Semiconductor Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2010-0046423 20100518; KR10-2010-0090352 20100915; KR10-2010-0096682 20101005; KR10-2010-0110149 20101108
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/06 ; H01L33/46 ; H01L33/56 ; H01L25/075 ; H01L33/44

Abstract:
A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a wavelength converting layer configured to convert a wavelength of light emitted from the semiconductor stacked structure, the wavelength converting layer covering side surfaces of the substrate and the semiconductor stacked structure, and a distributed Bragg reflector (DBR) configured to reflect at least a portion of light wavelength-converted by the wavelength converting layer, in which at least a portion of the DBR is covered with a metal layer configured to reflect light transmitted through the DBR.
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