Invention Grant
- Patent Title: Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant
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Application No.: US15102847Application Date: 2014-12-19
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Publication No.: US10044003B2Publication Date: 2018-08-07
- Inventor: Young-Jun Park , Kyoung-Bo Kim , Moo-Jin Kim , Soo-Cherl Lee , Jae-Ryung Lee
- Applicant: POSCO
- Applicant Address: KR Pohang-si, Gyeongsangbuk-do
- Assignee: POSCO
- Current Assignee: POSCO
- Current Assignee Address: KR Pohang-si, Gyeongsangbuk-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0160819 20131220
- International Application: PCT/KR2014/012606 WO 20141219
- International Announcement: WO2015/093903 WO 20150625
- Main IPC: H01L51/52
- IPC: H01L51/52 ; B32B9/00 ; B32B9/04 ; B32B15/08 ; B32B27/28 ; B32B27/30 ; B32B27/32 ; B32B27/40 ; H01L51/44
Abstract:
The present invention relates to a metal encapsulant having good heat dissipation properties, a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant, and particularly, to a metal encapsulant having excellent flexibility, moisture resistance, workability, and heat dissipation properties by forming a coating layer including a metal graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant.
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Information query
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