Invention Grant
- Patent Title: Conductive-layer-integrated flexible printed circuit board
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Application No.: US15629504Application Date: 2017-06-21
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Publication No.: US10045433B2Publication Date: 2018-08-07
- Inventor: Masayoshi Kido , Yoshihide Sekito
- Applicant: Kaneka Corporation
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Kagan Binder, PLLC
- Priority: JP2012-159939 20120718
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; C09D5/33 ; G03F7/027

Abstract:
The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.
Public/Granted literature
- US20170290141A1 CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2017-10-05
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