- Patent Title: Printed circuit board, package and method of manufacturing the same
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Application No.: US14989558Application Date: 2016-01-06
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Publication No.: US10045444B2Publication Date: 2018-08-07
- Inventor: Jae-Ean Lee , Jee-Soo Mok , Young-Gwan Ko , Kyung-Hwan Ko , Yong-Ho Baek
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0003598 20150109
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/46 ; H05K3/40 ; H05K1/11 ; H05K3/00 ; H05K3/34

Abstract:
A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.
Public/Granted literature
- US20160205780A1 PRINTED CIRCUIT BOARD, PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-07-14
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