Invention Grant
- Patent Title: Method of assembly using moving substrates, including creating RFID inlays
-
Application No.: US14572000Application Date: 2014-12-16
-
Publication No.: US10049319B2Publication Date: 2018-08-14
- Inventor: Ian James Forster
- Applicant: Avery Dennison Retail Information Services, LLC
- Applicant Address: US OH Mentor
- Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
- Current Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
- Current Assignee Address: US OH Mentor
- Agency: Avery Dennison Retail Information Services, LLC
- Main IPC: G06K19/077
- IPC: G06K19/077

Abstract:
A method of assembling products selects first and second planar substrates, each having a plurality of articles respectively positioned on each substrate, which articles are to be assembled together. While one of the substrates moves at a generally linear speed, the other substrate moves in a spiral fashion through an assembly location such as a nip roller to thereby match their respective speeds, resulting alignment of respective articles for assembling of the two different types of articles together from two substrates having differing pitch placement of their respective articles thereon. The non-spiraling substrate is a plurality of flights of articles in an array, and the other substrate has a block of the other articles. Typically, the number of flights corresponds to the number of articles in the block.
Public/Granted literature
- US20160172743A1 METHOD OF ASSEMBLY USING MOVING SUBSTRATES, INCLUDING CREATING RFID INLAYS Public/Granted day:2016-06-16
Information query