Invention Grant
- Patent Title: Coil device
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Application No.: US15447975Application Date: 2017-03-02
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Publication No.: US10049805B2Publication Date: 2018-08-14
- Inventor: Katsumi Kobayashi
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-048633 20160311
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F27/28 ; H01F27/32 ; H01F5/02 ; H01F41/00 ; H01Q7/06
Abstract:
A coil device has a potting resin 60. The potting resin 60 surrounds a bobbin 20 with a coil portion 12. The coil portion 12 is housed in a housing concave portion 42 of an outer case 40. Oblique plate legs 50 arranged obliquely are arranged between an outer peripheral wall 24 of the bobbin 20 and a bottom wall of the housing concave portion 42.
Public/Granted literature
- US20170263368A1 COIL DEVICE Public/Granted day:2017-09-14
Information query
