This invention relates to a thermal interface device (206) arranged to provide a thermal coupling interface between a heat-generating unit (202) and a heat-removing unit (204), comprising a liner layer (210), which has opposite first and second surfaces (218,220), at least the first surface being a slide surface, and which is provided with multiple perforations (212); and a thermal connection layer (208), which is engaged with the liner layer at the second surface (220) thereof, and which is one of elastically and inelastically deformable. The thermal interface device has an idle state where the perforations are open, and an active state where the perforations are filled with a part of the thermal connection layer. The thermal connection layer is arranged to be deformed by the thermal interface device being subjected to a compression force exceeding a deformation threshold, and thereby to fill the perforations.