Invention Grant
- Patent Title: Semiconductor package on package structure and method of forming the same
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Application No.: US14450201Application Date: 2014-08-01
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Publication No.: US10049977B2Publication Date: 2018-08-14
- Inventor: Hong Bok We , Dong Wook Kim , Jae Sik Lee , Kyu-Pyung Hwang , Young Kyu Song
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C./Qualcomm
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L25/10 ; H01L21/48 ; H01L23/31 ; H01L25/065 ; H01L23/538
Abstract:
A package on package structure may be formed by fabricating or providing a bottom package having a substrate, at least one die on top of the substrate, and bonding pads on the top of the substrate. Next, a frame is formed on the bonding pads and connected to the bonding pads. Next, a package material is molded over the top of the substrate to encapsulate the frame, the die, and the pads or substantially encapsulates these components. Next, a portion of the molded package material is removed to expose at least a portion of the frame. The exposed frame portions are formed such that a desired fan in or fan out configuration is obtained. Next, a non-conductive layer is formed on the exposed frame. Last, a second package having a die or chip is connected to the exposed portion of the frame to form a package on package structure.
Public/Granted literature
- US20160035664A1 SEMICONDUCTOR PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2016-02-04
Information query
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