A package structure and method of making the same is provided. A through via is formed on a substrate, the through via extending through a molding material. An upper surface of the molding material is recessed from an upper surface of the through via. A dielectric layer is deposited over the through via and the molding material. The dielectric layer has a first upper surface with a first variation in height between a first area disposed over the through via and a second area disposed over the molding material. Exposure processes are performed on the dielectric layer. The dielectric layer is developed. After the developing, the dielectric layer has a second upper surface with a second variation in height between the first area and the second area. The first variation is greater than the second variation.