Invention Grant
- Patent Title: BAW device and method of manufacturing BAW device
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Application No.: US15238323Application Date: 2016-08-16
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Publication No.: US10050599B2Publication Date: 2018-08-14
- Inventor: Jun Abatake
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2015-168073 20150827
- Main IPC: H03H9/09
- IPC: H03H9/09 ; H03H9/05 ; H03H9/54 ; H03H3/02 ; H03H9/02
Abstract:
A BAW device includes a substrate and a piezoelectric element formed on a surface of the substrate. The substrate has a plurality of elastic wave diffusing regions disposed therein for diffusing an elastic wave, the elastic wave diffusing regions being formed by modifying the inside of the substrate with a laser beam.
Public/Granted literature
- US20170063334A1 BAW DEVICE AND METHOD OF MANUFACTURING BAW DEVICE Public/Granted day:2017-03-02
Information query
