Invention Grant
- Patent Title: Embedded layered inductor
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Application No.: US14073756Application Date: 2013-11-06
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Publication No.: US10051741B2Publication Date: 2018-08-14
- Inventor: Young Kyu Song , Daeik Daniel Kim , Xiaonan Zhang , Ryan David Lane , Jonghae Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/16 ; H05K1/14
Abstract:
An embedded layered inductor is provided that includes a first inductor layer and a second inductor layer coupled to the first inductor layer. The first inductor layer comprises a patterned metal layer that may also be patterned to form pads. The second inductor layer comprises metal deposited in a dielectric layer adjacent the patterned metal layer.
Public/Granted literature
- US20150124418A1 EMBEDDED LAYERED INDUCTOR Public/Granted day:2015-05-07
Information query
