Invention Grant
- Patent Title: Assembling apparatus and assembling method
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Application No.: US14312938Application Date: 2014-06-24
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Publication No.: US10052728B2Publication Date: 2018-08-21
- Inventor: Dai Iwasaki , Yasuo Tachibana , Hiroyuki Yamauchi
- Applicant: KOITO MANUFACTURING CO., LTD.
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: KOITO MANUFACTURING CO., LTD.
- Current Assignee: KOITO MANUFACTURING CO., LTD.
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-132405 20130625
- Main IPC: B23P19/04
- IPC: B23P19/04 ; B23P19/10 ; B25J15/00

Abstract:
An assembling apparatus configured to mount a first part on a second part having an engaged part extending in a first direction includes a holding part configured to hold the first part, an engaging part extending in the first direction and being configured to engage with the engaged part, a support part configured to support the holding part and the engaging part, a first mechanism configured to displace the support part in the first direction, and a second mechanism configured to allow a displacement of the support part in a plane intersecting with the first direction.
Public/Granted literature
- US20140373337A1 ASSEMBLING APPARATUS AND ASSEMBLING METHOD Public/Granted day:2014-12-25
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