Invention Grant
- Patent Title: Carbon nanotube/polyetherimide/thermosetting resin dielectric composite and preparation method therefor
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Application No.: US15534500Application Date: 2015-05-28
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Publication No.: US10053544B2Publication Date: 2018-08-21
- Inventor: Guozheng Liang , Yicheng Jiao , Aijuan Gu , Li Yuan
- Applicant: SOOCHOW UNIVERSITY
- Applicant Address: CN Suzhou
- Assignee: SOOCHOW UNIVERSITY
- Current Assignee: SOOCHOW UNIVERSITY
- Current Assignee Address: CN Suzhou
- Agency: SZDC Law P.C.
- Priority: CN201410832252 20141229
- International Application: PCT/CN2015/080146 WO 20150528
- International Announcement: WO2016/107058 WO 20160707
- Main IPC: C08J3/00
- IPC: C08J3/00 ; C08K7/24 ; C08L63/00 ; C08L79/04 ; C08L79/08 ; B29B7/00 ; B29B7/18 ; B29B7/82 ; C08J3/20 ; C08L35/00 ; H01B3/30 ; H01B3/40 ; H01B3/44 ; C08J3/205 ; B29K63/00 ; B29K79/00 ; B29K307/04

Abstract:
The invention discloses a carbon nanotube/polyetherimide/thermosetting resin dielectric composite and a preparation method therefor. 100 parts by weight of polyetherimide and 1-7 parts by weight of carbon nanotube are mixed uniformly in an Haake torque melt cavity to obtain a carbon nanotubes/polyetherimide composite; 20 parts of the carbon nanotube/polyetherimide composite are dissolved in 100-150 parts of dichloromethane, then the mixed solution is added in 100 parts of molten thermocurable thermosetting resin, mixing, and heat preserving, stirring are performed until a mixture is formed in a uniform state, and curing and post-treating are performed to obtain a carbon nanotube/thermosetting resin dielectric composite, wherein the substrate thereof has a typical reverse phase structure, while the carbon nanotubes are dispersed in a polyetherimide phase. The composite has a relatively low percolation threshold, a high dielectric constant and a low dielectric loss. The preparation method of the present invention has a simple process and is suitable for large-scale production.
Public/Granted literature
- US20170335069A1 CARBON NANOTUBE/POLYETHERIMIDE/THERMOSETTING RESIN DIELECTRIC COMPOSITE AND PREPARATION METHOD THEREFOR Public/Granted day:2017-11-23
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