Invention Grant
- Patent Title: Method and device for modifying resin
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Application No.: US15575225Application Date: 2016-05-17
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Publication No.: US10053548B2Publication Date: 2018-08-21
- Inventor: Toshinori Miura , Mitsuru Kekura , Yoshiki Morikawa
- Applicant: MEIDENSHA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MEIDENSHA CORPORATION
- Current Assignee: MEIDENSHA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2015-103305 20150521
- International Application: PCT/JP2016/064555 WO 20160517
- International Announcement: WO2016/186096 WO 20161124
- Main IPC: C08F8/06
- IPC: C08F8/06 ; C08J7/12 ; C08C19/04

Abstract:
It is a modification apparatus (1) of a resin film (6) for making the surface of the resin film (6) hydrophilic. The modification apparatus (1) has a chamber (2), an unsaturated hydrocarbon supply device (3), and an ozone generating device (4). In the chamber (2), there are provided a supply roll (7) onto which the resin film (6) is previously wound, a take-up roll (8), and a shower head (10). While the resin film (6) wound onto the supply roll (7) is wound onto the take-up roll (8), a high-concentration ozone gas and an unsaturated hydrocarbon gas are supplied to the surface of the resin film (6) moving between the supply roll (7) and the take-up roll (8).
Public/Granted literature
- US20180148558A1 METHOD AND DEVICE FOR MODIFYING RESIN Public/Granted day:2018-05-31
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