A resin composition containing an ethylene-vinylalcohol copolymer (A) and a hydroxyl group containing compound (B), the hydroxyl group containing compound (B) having a molecular weight of 200 or less, a ratio of the number of hydroxyl groups in one molecule relative to the molecular weight within a range of 0.02-0.03, and a melting point of 23° C. or higher, the content of the hydroxyl group containing compound (B) being 3-15 mass % relative to the resin composition, a molded product using the same, and a multilayer structure including a layer composed of the resin composition.