Invention Grant
- Patent Title: Conductive material and substrate
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Application No.: US15334635Application Date: 2016-10-26
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Publication No.: US10053588B2Publication Date: 2018-08-21
- Inventor: Jun Hatakeyama , Takayuki Nagasawa
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-219908 20151109; JP2016-174638 20160907
- Main IPC: H01B1/24
- IPC: H01B1/24 ; C09D5/24 ; C09D133/16 ; C09D125/18 ; H01B1/12 ; C08F12/20 ; C08F12/22 ; C08F12/30 ; C08F212/14 ; C08F220/24

Abstract:
The present invention provides a conductive material including: (A) a π-conjugated polymer, (B) a dopant polymer which contains one or more repeating units selected from “a1” to “a4” respectively shown by the following general formula (1) and has a weight-average molecular weight in the range of 1,000 to 500,000, and (C) one or more salts selected from the group consisting of a silver salt of carboxylic acid, a silver salt of β-diketone, a silver salt of β-ketoester, and silver carbonate. There can be provided a conductive material that has excellent film-formability and also can form a conductive film having high transparency and conductivity, superior flexibility and flatness when the film is formed from the material.
Public/Granted literature
- US20170130071A1 CONDUCTIVE MATERIAL AND SUBSTRATE Public/Granted day:2017-05-11
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