An electrical brush plating system and method for metal parts wherein a motion control member and a plating bath with a plating pen includes an anode member provided with an anode plate and bristles that are mounted on the motion control member. A part to be plated is disposed within the plating bath with the bristles provided towards the surface of the part to be plated and under the control of the motion control member, the bristles perform a relative friction motion with the surface of the part to be plated. During the relative friction motion, the surface of the part to be plated is opposite to the anode plate of the anode member. The method includes the steps of mounting the plating pen and the part to be plated; electrocleaning; strong activation; weak activation and electrical brush plating. The generation of pinholes, pits and nodules are avoided.