Invention Grant
- Patent Title: Method and system of robot fork calibration and wafer pick-and-place
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Application No.: US15281110Application Date: 2016-09-30
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Publication No.: US10056282B2Publication Date: 2018-08-21
- Inventor: Dong Xu
- Applicant: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Tianchen LLC
- Priority: CN201511021465 20151231; CN201511022412 20151231; CN201511023889 20151231
- Main IPC: G05B19/04
- IPC: G05B19/04 ; H01L21/677 ; H01L21/67 ; H01L21/68 ; B25J9/16

Abstract:
A robot fork calibration method and system is provided. At least three non-linear arranged lower sensors are provided on a bottom surface of the fork to detect distances to a fixed detection point. The fixed detection point and a horizontal plane of the detection point define a reference coordinate system. Spatial coordinates of the lower sensors in the reference coordinate system are calculated and a plane equation as well as a tilted angle of the fork are obtained according to the spatial coordinates. Therefore, the height of the fork can be calibrated according to the Z axis coordinates of the lower sensors and the levelness of the fork can be calibrated according to the tilted angle.
Public/Granted literature
- US20170194183A1 METHOD AND SYSTEM OF ROBOT FORK CALIBRATION AND WAFER PICK-AND-PLACE Public/Granted day:2017-07-06
Information query
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