Invention Grant
- Patent Title: Semiconductor wafer device and manufacturing method thereof
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Application No.: US15790797Application Date: 2017-10-23
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Publication No.: US10056285B2Publication Date: 2018-08-21
- Inventor: Bor-Ping Jang , Chien Ling Hwang , Hsin-Hung Liao , Yeong-Jyh Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/683 ; B23K26/40 ; B23K26/402 ; H01L21/78 ; B23K26/364 ; H01L23/544 ; B23K103/00
Abstract:
A method of dies singulation includes providing a carrier, disposing a plurality of dies over a surface of the carrier according to a plurality of scribe lines comprising a plurality of continuous lines along a first direction and a plurality of discontinuous lines along a second direction, cutting the carrier according to the plurality of continuous lines along the first direction, and cutting the carrier according to the plurality of discontinuous lines along the second direction.
Public/Granted literature
- US20180047611A1 SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-02-15
Information query
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