Invention Grant
- Patent Title: Electrolytic seal
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Application No.: US15275887Application Date: 2016-09-26
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Publication No.: US10056310B2Publication Date: 2018-08-21
- Inventor: Bing Dang , Yu Luo
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Louis Percello
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/10 ; H01L31/0203 ; H01L21/48 ; B81B7/00 ; B81C1/00
Abstract:
A semiconductor device includes a first bonding surface disposed on a first component of the semiconductor device. A bond material is disposed on the first bonding surface, and a second bonding surface is disposed on a second component of the semiconductor device. The bond material is disposed on the second bonding surface. A first electroplated bond connects the bond material and the first bonding surface, and a second electroplated bond connects the bond material and the second bonding surface.
Public/Granted literature
- US20180090403A1 ELECTROLYTIC SEAL Public/Granted day:2018-03-29
Information query
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