Systems and methods for lead frame-based chip carriers for use with MEMS transducers. One embodiment provides a method for manufacturing a MEMS microphone package. In one exemplary embodiment, the method includes flip chip bonding a first plurality of I/O pads on an application specific integrated circuit to a plurality of traces on a lead frame. The method further includes removing at least one of the plurality of traces such that at least one of the first plurality of I/O pads is electrically isolated from the lead frame. The method further includes bonding the lead frame to a lid and electrically connecting, via at least one wire bond, a MEMS microphone mounted to the lid to the application specific integrated circuit using a second plurality of I/O pads of the application specific integrated circuit. The method further includes bonding a substrate to the lead frame to form an air tight volume within the lid.