Invention Grant
- Patent Title: Wiring board and electronic device
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Application No.: US15465150Application Date: 2017-03-21
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Publication No.: US10057977B2Publication Date: 2018-08-21
- Inventor: Kenichi Kawai
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-091756 20160428
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H04B3/32 ; H04B1/16 ; H04B1/30

Abstract:
A wiring board includes a first wire, a second wire, a third wire and a fourth wire formed over a substrate and extending in a first direction respectively, the second wire being adjacent to the first wire in the first direction, and the third wire being adjacent to the first wire in a second direction orthogonal to the first direction, and the fourth wire being adjacent to the second wire in the second direction, a pair of fifth wires, a pair of sixth wires, a pair of seventh wires and a pair of eighth wires formed in the substrate and extending in the second direction respectively, a pair of ninth signal vias, a pair of tenth signal vias, a pair of eleventh signal vias and a pair of twelfth signal vias formed in the substrate and extending in a third direction orthogonal to a surface of the substrate respectively.
Public/Granted literature
- US20170318667A1 WIRING BOARD AND ELECTRONIC DEVICE Public/Granted day:2017-11-02
Information query