Invention Grant
- Patent Title: Solderable two piece board level shields
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Application No.: US15453166Application Date: 2017-03-08
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Publication No.: US10058015B2Publication Date: 2018-08-21
- Inventor: Kenneth M. Robinson , Paul W. Crotty
- Applicant: Laird Technologies, Inc.
- Applicant Address: US MO Earth City
- Assignee: LAIRD TECHNOLOGIES, INC.
- Current Assignee: LAIRD TECHNOLOGIES, INC.
- Current Assignee Address: US MO Earth City
- Agency: Harness, Dickey & Pierce, P.L.C.
- Agent Anthony G. Fussner
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02

Abstract:
According to various aspects, exemplary embodiments are disclosed of a two-piece metallic board level shield (BLS). In an exemplary embodiment, the BLS is solderable to a printed circuit board (PCB). The BLS includes a lid or cover and a fence or frame. The lid and fence are complementary in shape. The lid may be mounted onto the fence via a locking mechanism in a first position and a compressed second position, where the locking mechanism provides resistance against internal upward forces when the BLS has been compressed into a second position. The BLS may be soldered to the PCB while in the first position, and subsequently compressed into the second position after the solder has hardened.
Public/Granted literature
- US20170181336A1 SOLDERABLE TWO PIECE BOARD LEVEL SHIELDS Public/Granted day:2017-06-22
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