An electronic component mounting system includes: mounting line management apparatuses disposed in each of mounting lines and an integrated management apparatus connected to the mounting line management apparatuses. The integrated management apparatus includes a first collation unit which performs collation of an electronic component based on identification information for identifying the electronic component. The mounting line management apparatus includes a second collation unit which performs collation of the electronic component. When the identification information is read out by the identification information reading-out unit, the collation of the electronic component is performed by the first collation unit if the mounting line management apparatus can access the integrated management apparatus, and the collation of the electronic component is performed by the second collation unit if the mounting line management apparatus cannot access the integrated management apparatus.