Invention Grant
- Patent Title: Fabrication method of package having ESD and EMI preventing functions
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Application No.: US14817624Application Date: 2015-08-04
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Publication No.: US10062582B2Publication Date: 2018-08-28
- Inventor: Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW99140955A 20101126
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/552 ; H01L23/00
Abstract:
A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.
Public/Granted literature
- US20150340248A1 FABRICATION METHOD OF PACKAGE HAVING ESD AND EMI PREVENTING FUNCTIONS Public/Granted day:2015-11-26
Information query
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