Invention Grant
- Patent Title: Semiconductor package substrate, package system using the same and method for manufacturing thereof
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Application No.: US14401602Application Date: 2013-05-24
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Publication No.: US10062623B2Publication Date: 2018-08-28
- Inventor: Sung Wuk Ryu , Dong Sun Kim , Seung Yul Shin
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: LRK Patent Law Firm
- Priority: KR10-2012-0056356 20120525
- International Application: PCT/KR2013/004578 WO 20130524
- International Announcement: WO2013/176519 WO 20131128
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H05K1/18 ; H01L25/065
Abstract:
A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.
Public/Granted literature
- US20150130060A1 SEMICONDUCTOR PACKAGE SUBSTRATE, PACKAGE SYSTEM USING THE SAME AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2015-05-14
Information query
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