Invention Grant
- Patent Title: Packaging substrate and electronic package having the same
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Application No.: US15063592Application Date: 2016-03-08
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Publication No.: US10062651B2Publication Date: 2018-08-28
- Inventor: Fang-Yu Liang , Hung-Hsien Chang , Yi-Che Lai , Chang-Fu Lin
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW104144006A 20151228
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/522 ; H01L23/16 ; H01L21/48 ; H01L23/14 ; H01L23/15 ; H01L23/498
Abstract:
A packaging substrate is provided, which includes: a substrate body having a first region with a plurality of conductive pads and a second region adjacent to the first region, and a material layer formed on the second region to prevent the substrate body from warping. An electronic package having the packaging substrate is also provided.
Public/Granted literature
- US20170186702A1 PACKAGING SUBSTRATE AND ELECTRONIC PACKAGE HAVING THE SAME Public/Granted day:2017-06-29
Information query
IPC分类:
