Various systems, devices and methods are provided for interconnection between wafers and/or chips using catch flexures. In one example, among others, a catch flexure assembly includes a first interconnect affixed to a first wafer. The first interconnect can include a female opening at a distal end of a flexible member that is configured to receive a male extension of a second interconnect affixed to a second wafer when the first wafer is aligned with the second wafer, and retain the male extension during a bonding process of the first and second flexible interconnects. The catch flexure assembly can also include bonding material disposed adjacent to the female opening, which is configured to secure the male extension in the female opening during the bonding process.