Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US14961900Application Date: 2015-12-08
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Publication No.: US10062695B2Publication Date: 2018-08-28
- Inventor: Shang-Chi Tsai , Kang-Min Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/331
- IPC: H01L21/331 ; H01L27/092 ; H01L21/266 ; H01L21/3115 ; H01L21/8238 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a substrate, a metal-oxide-semiconductor (MOS) transistor, and a dielectric layer. The MOS transistor includes a gate structure formed over the substrate. The dielectric layer is formed aside the gate structure, and the dielectric layer is doped with a strain modulator. An effective lattice constant of the dielectric layer modified by the doping with the strain modulator is different from an effective lattice constant of the dielectric layer prior to the doping.
Public/Granted literature
- US20170162573A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-06-08
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