Invention Grant
- Patent Title: Ground routing device and method
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Application No.: US15024904Application Date: 2013-12-18
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Publication No.: US10062981B2Publication Date: 2018-08-28
- Inventor: Karlheinz Muth , Brent Rothermel
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2013/076021 WO 20131218
- International Announcement: WO2015/094214 WO 20150625
- Main IPC: H04B10/40
- IPC: H04B10/40 ; G02B6/42 ; H01R12/52 ; H01R12/57 ; H01R13/6471

Abstract:
Electronic devices and associated methods are shown including a connector mounted to a printed circuit board (PCB). Examples shown include a number of ground vias passing through the PCB to a second side of the PCB, wherein the number of ground vias is smaller than a number of ground sites. Selected examples include an optoelectronic connector mounted using surface mount technology.
Public/Granted literature
- US20160218453A1 GROUND ROUTING DEVICE AND METHOD Public/Granted day:2016-07-28
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