Invention Grant
- Patent Title: Wire cover
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Application No.: US15245224Application Date: 2016-08-24
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Publication No.: US10063007B2Publication Date: 2018-08-28
- Inventor: Shinpei Sugimoto
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2015-183849 20150917
- Main IPC: H01R13/56
- IPC: H01R13/56 ; H01R13/58 ; H02G3/04 ; H02G3/08 ; H01R4/00 ; H01B17/26 ; F16L3/10 ; H01R13/506 ; H01R107/00

Abstract:
A wire cover (10) is mounted on a rear surface of a housing (30) so that a bundle of wires can be (31) pulled out in a predetermined direction from a rear surface of the housing (30). The wire cove (10) includes a band inserting portion (15) having a curved shape to extend along a part of an outer surface of the bundle of the wires (31) in a circumferential direction and defines a route for a binding member (40) for binding the bundle of the wires (30). A lock fixing portion (47) is provided on an end of the band inserting portion (15) in the circumferential direction and is configured to position a lock (42) of the binding member (40) for locking a band (41) wound around the bundle of wires (31) at a predetermined position, and a reinforcing portion (18) is provided on the lock fixing portion (17).
Public/Granted literature
- US20170085067A1 WIRE COVER Public/Granted day:2017-03-23
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