Invention Grant
- Patent Title: Component mounter
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Application No.: US14411156Application Date: 2012-07-02
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Publication No.: US10064320B2Publication Date: 2018-08-28
- Inventor: Hidetoshi Kawai , Masafumi Amano , Katsushi Ota , Kazuhiro Asada , Tsutomu Kunihiro
- Applicant: Hidetoshi Kawai , Masafumi Amano , Katsushi Ota , Kazuhiro Asada , Tsutomu Kunihiro
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2012/066876 WO 20120702
- International Announcement: WO2014/006670 WO 20140109
- Main IPC: H05K13/04
- IPC: H05K13/04 ; B65D88/54

Abstract:
A component mounter which picks components which are stored in tape and supplied from a component supply device by a component picking device and mounts components on a board which is conveyed by a board conveyance device including a waste box which stores the cut tape after the components are picked, a scraping out device which can scrape the tape out of the waste box, and a control device which controls scraping out the stored tape by the scraping out device when the tape is stored in the waste box to a predetermined amount.
Public/Granted literature
- US20150208561A1 COMPONENT MOUNTER Public/Granted day:2015-07-23
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