A component crimping apparatus includes a crimping tool that sucks a film-like component and presses a crimping section of the sucked film-like component against the substrate to crimp the film-like component to the substrate. The crimping tool includes a block holding portion that includes a guide member extending in one direction within a horizontal plane, first suction blocks that are provided movably along the guide member and that sucks an upper part of the crimping section of the film-like component, a second suction block that is provided movably along the guide member of the block holding portion and that sucks an upper part of a non-crimping section of the film-like component and a block fixation unit that fixes the first suction blocks and the second suction block to the guide member.