Invention Grant
- Patent Title: Device and method for cleaving
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Application No.: US15339923Application Date: 2016-10-31
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Publication No.: US10065340B2Publication Date: 2018-09-04
- Inventor: Gal Moyal
- Applicant: LatticeGear, LLC
- Applicant Address: US OR Beaverton
- Assignee: LatticeGear, LLC
- Current Assignee: LatticeGear, LLC
- Current Assignee Address: US OR Beaverton
- Agency: Ater Wynne LLP
- Main IPC: B28D5/00
- IPC: B28D5/00 ; B26F3/00 ; B26D5/00 ; B28D1/22 ; B28D7/02

Abstract:
A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.
Public/Granted literature
- US20170087744A1 DEVICE AND METHOD FOR CLEAVING Public/Granted day:2017-03-30
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