Invention Grant
- Patent Title: Method of automatically adding supporting structure to 3D model
-
Application No.: US15091801Application Date: 2016-04-06
-
Publication No.: US10065374B2Publication Date: 2018-09-04
- Inventor: Kwan Ho , Bo-Yi Wu
- Applicant: XYZPRINTING, INC. , KINPO ELECTRONICS, INC.
- Applicant Address: TW New Taipei TW New Taipei
- Assignee: XYZPRINTING, INC.,KINPO ELECTRONICS, INC.
- Current Assignee: XYZPRINTING, INC.,KINPO ELECTRONICS, INC.
- Current Assignee Address: TW New Taipei TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: CN201610080907 20160205
- Main IPC: B29C67/00
- IPC: B29C67/00 ; G05B17/02 ; G05B19/402 ; B33Y50/02

Abstract:
A printing slicing method for 3D model for automatically adding a required supporting structure to a 3D model is disclosed. The method includes following steps. Retrieve a minimum overlapping ratio corresponding to a layer height. Execute a slicing process and analyze an overlapping ratio between two molded object slices which form a suspended slope. Add the supporting structure below the corresponding suspended slope when determining that the overlapping ratio is less than the minimum overlap ratio. This disclosed example can effectively prevent the suspended part of a printed 3D model entity from a deformation because of the adhesion area thereon is too small, and can also effectively save the printing time and the usage amount of supplies.
Public/Granted literature
- US20170225397A1 PRINTING SLICING METHOD FOR 3D MODEL Public/Granted day:2017-08-10
Information query