Invention Grant
- Patent Title: Systems and methods for separation of thermal interface bond
-
Application No.: US15284955Application Date: 2016-10-04
-
Publication No.: US10065407B2Publication Date: 2018-09-04
- Inventor: Lawrence A. Kyle , Corey Dean Hartman , Hsu-Chu Wang
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Jackson Walker L.L.P.
- Main IPC: B32B38/10
- IPC: B32B38/10 ; B32B43/00 ; G06F1/20 ; G06F1/18

Abstract:
In accordance with these and embodiments of the present disclosure, an information handling system may include a circuit board, an information handling resource electrically coupled to the circuit board, and a mechanical mechanism configured to receive a user interaction at a mechanical mechanism, and, in response to the user interaction, separate a mechanical bond between the information handling resource and a component by applying a controlled force of the mechanical mechanism to the information handling resource at a controlled location of the information handling resource.
Public/Granted literature
- US20180093465A1 SYSTEMS AND METHODS FOR SEPARATION OF THERMAL INTERFACE BOND Public/Granted day:2018-04-05
Information query