Invention Grant
- Patent Title: Optimized epoxy die attach geometry for MEMS die
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Application No.: US15161724Application Date: 2016-05-23
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Publication No.: US10065853B2Publication Date: 2018-09-04
- Inventor: Jim Golden , Robert Stuelke
- Applicant: Rosemount Aerospace Inc.
- Applicant Address: US MN Burnsville
- Assignee: Rosemount Aerospace Inc.
- Current Assignee: Rosemount Aerospace Inc.
- Current Assignee Address: US MN Burnsville
- Agency: Kinney & Lange, P.A.
- Main IPC: B81B7/00
- IPC: B81B7/00 ; G01L19/14 ; G01L9/00 ; B81C1/00

Abstract:
A differential pressure sensor is a body with first and second interior channels connected to process fluid inlets and separated by a barrier. Each side of a MEMS pressure sensing diaphragm in the barrier is fluidly connected to a process fluid inlet. The diaphragm is mounted on a hollow pedestal such that one side of the diaphragm is fluidly connected to a process fluid inlet through an interior channel in the pedestal that is adhesively attached to an annular bottom of a cylindrical cavity inside the body. The other side of the diaphragm is fluidly connected to the other process fluid inlet and is fluidly isolated from the first fluid inlet by the adhesive at the bottom of the pedestal. Deformation of the diaphragm due to a pressure difference between the process fluid inlets detected by sensors on the diaphragm indicates a differential pressure.
Public/Granted literature
- US20170334713A1 OPTIMIZED EPOXY DIE ATTACH GEOMETRY FOR MEMS DIE Public/Granted day:2017-11-23
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