Invention Grant
- Patent Title: Poly-crystalline silicon ingot having a nucleation promotion layer comprising a plurality of chips and chunks of poly-crystalline silicon on the bottom
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Application No.: US15583413Application Date: 2017-05-01
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Publication No.: US10065863B2Publication Date: 2018-09-04
- Inventor: Wen-Huai Yu , Cheng-Jui Yang , Yu-Min Yang , Kai-Yuan Pai , Wen-Chieh Lan , Chan-Lu Su , Yu-Tsung Chiang , Sung-Lin Hsu , Wen-Ching Hsu , Chung-Wen Lan
- Applicant: Sino-American Silicon Products Inc.
- Applicant Address: TW Hsinchu
- Assignee: Sino-American Silicon Products Inc.
- Current Assignee: Sino-American Silicon Products Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Osha Liang LLP
- Priority: TW100143484A 20111128
- Main IPC: C30B29/06
- IPC: C30B29/06 ; C01B33/021 ; C30B28/06 ; H01L31/18 ; H01L31/0368

Abstract:
A poly-crystalline silicon ingot having a bottom and defining a vertical direction includes a plurality of silicon grains grown in the vertical direction, in which the plurality of the silicon grains have at least three crystal orientations; and a nucleation promotion layer comprising a plurality of chips and chunks of poly-crystalline silicon on the bottom, wherein the poly-crystalline silicon ingot has a defect density at a height ranging from about 150 mm to about 250 mm of the poly-crystalline silicon ingot that is less than 15%.
Public/Granted literature
- US20170233257A1 CRYSTALLINE SILICON INGOT INCLUDING NUCLEATION PROMOTION LAYER AND METHOD OF FABRICATING THE SAME Public/Granted day:2017-08-17
Information query
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