High impact polystyrenes and related monovinyl aromatic polymers generally have either a high modulus or good resistance to environmental stress cracking. The present invention is directed at polymeric materials having both a high modulus and good resistance to environmental stress cracking thus enabling the down gauging of parts, and or the use of the materials in new applications. The invention is predicated on the use of one or more, or even all of the following features: a high molecular weight matrix polymer, reduced concentration of elastomeric polymer, or methods that result in large rubber particle size.