Invention Grant
- Patent Title: Polyamide resin composition, polyamide resin composition pellet group, molded article, and method for producing a polyamide resin composition
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Application No.: US15310260Application Date: 2015-12-25
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Publication No.: US10066104B2Publication Date: 2018-09-04
- Inventor: Shunichiro I , Norio Sakata , Katsushi Watanabe , Tetsuo Kurihara
- Applicant: ASAHI KASEI KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-266042 20141226
- International Application: PCT/JP2015/006486 WO 20151225
- International Announcement: WO2016/103733 WO 20160630
- Main IPC: C08L77/06
- IPC: C08L77/06 ; C08K3/10
Abstract:
The object is to provide a polyamide resin composition having superior productivity and mechanical strength. A polyamide resin composition includes: (A) Polyamide 66; (B) glass fibers; and (C) a copper compound and a halide. The percentage of a component of the (A) Polyamide 66 having a molecular weight of 30,000 or less as obtained by Gel Permeation Chromatography (GPC) is within a range from 30% by mass to 37% by mass of the total amount of the (A) Polyamide 66, and the percentage of the (A) Polyamide 66 having a molecular weight of 100,000 or greater is within a range from 8% by mass to 15% by mass of the total amount of the (A) Polyamide 66.
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