Invention Grant
- Patent Title: Adhesive composition and adhesive sheet using the same
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Application No.: US14651393Application Date: 2012-12-28
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Publication No.: US10066135B2Publication Date: 2018-09-04
- Inventor: Kentaro Hoshi , Junichi Kuroki , Takahisa Taniguchi
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- International Application: PCT/JP2012/084164 WO 20121228
- International Announcement: WO2014/103040 WO 20140703
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C09J7/02 ; C09J133/08 ; C09J153/00 ; C09J133/10 ; C09J5/06 ; C08L33/06 ; C08L53/00 ; C08L63/00 ; C09J7/40 ; C09J7/10
Abstract:
An adhesive composition includes an epoxy-based resin, an acryl-based resin, and a curing agent. The acryl-based resin includes a triblock copolymer of methyl methacrylate-butyl acrylate-methyl methacrylate, or a modified product thereof.
Public/Granted literature
- US20160032157A1 ADHESIVE COMPOSITION AND ADHESIVE SHEET USING THE SAME Public/Granted day:2016-02-04
Information query
