Invention Grant
- Patent Title: Apparatus and method for thin-film processing applications
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Application No.: US15118810Application Date: 2014-02-21
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Publication No.: US10066291B2Publication Date: 2018-09-04
- Inventor: Thomas Deppisch
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- International Application: PCT/EP2014/053460 WO 20140221
- International Announcement: WO2015/124207 WO 20150827
- Main IPC: C23C14/58
- IPC: C23C14/58 ; C23C14/56 ; C23C14/24 ; C23C16/50 ; C23C16/56 ; H01J37/32

Abstract:
According to the present disclosure, a flexible substrate coating apparatus is provided. The flexible substrate coating apparatus includes a vacuum process chamber for processing a flexible substrate. The vacuum process chamber includes one or more deposition units and a cleaning unit positioned directly downstream of the one or more deposition units. In another aspect, a method for depositing a thin-film on a flexible substrate is provided. The method for depositing a thin-film on a flexible substrate includes vacuum coating of the flexible substrate, thereby depositing one or more layers on the flexible substrate, and cleaning the flexible substrate directly downstream of the coating.
Public/Granted literature
- US20170067149A1 APPARATUS AND METHOD FOR THIN-FILM PROCESSING APPLICATIONS Public/Granted day:2017-03-09
Information query
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