A socket assembly is disclosed. The socket assembly includes a light emitting diode (LED) package having an LED printed circuit board (PCB), a base frame, an isolator frame, and an electrical contact. The base frame has a base mounted to a support structure and a spring finger extending from the base, the spring finger applying a clamping force to the LED PCB that acts in a direction toward the support structure. The isolator frame is mounted to the support structure. The electrical contact is electrically connected to the LED PCB and disposed within the isolator frame, such that the isolator frame electrically isolates the base frame from the electrical contact.