Invention Grant
- Patent Title: Oven
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Application No.: US14729418Application Date: 2015-06-03
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Publication No.: US10066839B2Publication Date: 2018-09-04
- Inventor: Dong Ho Lee , Cheol Eun Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2014-0093416 20140723
- Main IPC: H05B6/10
- IPC: H05B6/10 ; F24C15/00 ; F24C15/08 ; H05B6/64

Abstract:
An oven with an improved cooling structure is provided. The oven includes a casing; a cooking chamber located inside the casing and including a top plate forming the top, side plates forming both sides, a back plate forming the back, and a bottom plate forming the bottom; a panel located between the casing and the cooking chamber and spaced apart from the casing to form a fluid path for air to move; and a connection fluid path that guides the movement of air flowing from one side of the panel to the other side of the panel.
Public/Granted literature
- US20160025352A1 OVEN Public/Granted day:2016-01-28
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