Invention Grant
- Patent Title: Vapor chamber heat flux rectifier and thermal switch
-
Application No.: US15261063Application Date: 2016-09-09
-
Publication No.: US10066876B2Publication Date: 2018-09-04
- Inventor: Feng Zhou , Ercan M. Dede , Mehdi Asheghi , James W. Palko , Kenneth E. Goodson
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the Leland Stanford Junior University
- Applicant Address: US KY Erlanger US CA Stanford
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.,The Board of Trustees of the Leland Stanford Junior University
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.,The Board of Trustees of the Leland Stanford Junior University
- Current Assignee Address: US KY Erlanger US CA Stanford
- Agency: Dinsmore & Shohl LLP
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F28D15/04

Abstract:
Embodiments of an evaporator chamber heat flux rectifier and thermal switch are provided. Some embodiments include an evaporator layer with a first thermally conductive surface, a wicking structure for facilitating evaporation of a fluid in the vapor chamber heat flux rectifier, and a condenser layer that includes a second thermally conductive surface. Some embodiments include a middle layer, where when heat is applied to the first thermally conductive surface, the vapor chamber heat flux rectifier operates as a thermal conductor. Some embodiments that operate as a thermal switch include a non-condensable gas reservoir that is coupled to the condenser layer. The non-condensable gas reservoir may store a non-condensable gas when a threshold heat flux is applied to the evaporator layer. The non-condensable gas provides thermal insulation between the evaporator layer and the condenser layer when the threshold heat flux is not applied to the evaporator layer.
Public/Granted literature
- US20180073814A1 VAPOR CHAMBER HEAT FLUX RECTIFIER AND THERMAL SWITCH Public/Granted day:2018-03-15
Information query